November 18, 2024
By: Nic Abelian Technology Correspondent
Absolics, a subsidiary of SKC based in Covington, Georgia, has been awarded up to $100 million in funding through the CHIPS for America program. This investment is aimed at advancing glass-core substrate technology, a next-generation innovation in semiconductor packaging that has the potential to significantly improve chip performance and energy efficiency.
A Leap Forward in Semiconductor Packaging
Glass-core substrates represent a significant breakthrough in the semiconductor industry, providing substantial advantages over traditional organic packaging methods. This new approach promises to enable more precise interconnections between circuits, improve thermal management, and increase energy efficiency—key factors that are crucial for the growing demands of high-performance computing, artificial intelligence (AI), and 5G technologies.
The U.S. government’s CHIPS Act, signed into law in 2022, is designed to incentivize domestic semiconductor production and research, with $52.7 billion allocated to revitalizing the industry. Absolics’ efforts to develop glass-core substrate technology align with the broader objectives of this initiative, specifically enhancing semiconductor packaging—a critical area of focus as chip designs become more complex and energy-demanding.
Revolutionizing the Future of High-Performance Chips
The global demand for high-performance chips continues to rise, fueled by the growing reliance on AI, cloud computing, and next-generation mobile technologies. Glass-core substrates could help address the increasing need for chips capable of processing large volumes of data quickly and efficiently. For AI applications, in particular, these chips are crucial for improving processing power while reducing energy consumption, which is vital for sustainability in data centers and mobile devices.
Absolics’ project is positioned to play a central role in the ongoing push for U.S. leadership in semiconductor technology. By securing this funding, Absolics will scale up its manufacturing capabilities and potentially revolutionize the future of semiconductor packaging. The goal is to enhance the performance of AI processors and other high-demand chips, which will be crucial as industries continue to require more powerful computing capabilities.
Domestic Manufacturing and National Security
Beyond technological advancements, this project also has broader implications for U.S. national security. The U.S. government has been seeking to reduce its reliance on foreign semiconductor suppliers, particularly those in Asia, as part of its broader strategy to strengthen domestic manufacturing capabilities. The CHIPS funding to Absolics will help the company contribute to this effort by providing the infrastructure and innovation needed to produce cutting-edge chips domestically.
While the excitement around glass-core substrates is palpable, experts caution that large-scale adoption of this technology will require substantial changes in current semiconductor fabrication processes. Manufacturers will need to adapt their infrastructure to accommodate the new materials and techniques. Despite these challenges, the potential benefits of glass-core substrates are undeniable, making it a crucial step toward the evolution of semiconductor design.
Looking Ahead
With the new CHIPS funding, Absolics is poised to make significant strides in the U.S. semiconductor industry. If successful, glass-core substrates could revolutionize chip manufacturing, improving everything from AI systems and data centers to mobile devices. As the U.S. continues to prioritize domestic innovation in semiconductors, advancements like these will be vital for maintaining leadership in the tech sector.
Absolics’ work on glass-core substrates could lay the groundwork for a new era of semiconductor design, one that balances power, efficiency, and sustainability in response to the world’s rapidly evolving technological needs.
